JPH01115254U - - Google Patents
Info
- Publication number
- JPH01115254U JPH01115254U JP981988U JP981988U JPH01115254U JP H01115254 U JPH01115254 U JP H01115254U JP 981988 U JP981988 U JP 981988U JP 981988 U JP981988 U JP 981988U JP H01115254 U JPH01115254 U JP H01115254U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- power point
- die pad
- integrated circuit
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP981988U JPH01115254U (en]) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP981988U JPH01115254U (en]) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115254U true JPH01115254U (en]) | 1989-08-03 |
Family
ID=31216899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP981988U Pending JPH01115254U (en]) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115254U (en]) |
-
1988
- 1988-01-28 JP JP981988U patent/JPH01115254U/ja active Pending